Industrial Motherboards

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QBi Pro 3.5 SBC

QBiP-1115G4EA

3.5” SubCompact Board with 11th Generation Intel® Core™ i3-1115G4E Processor, Dual Channel DDR4 memory, 1 x COM, 1 x SATA 6Gb/s, 4 x USB 3.2 Type A Gen 2x1, 2 x USB 3.2 Type C Gen 2x1, 4 x USB 2.0

Key Features

• 3.5

• Intel® Core™ i3-1115G4E Processor

• Dual Channel DDR4, 2 x SO-DIMMs

• 2 x GbE LAN Ports

• 1 x SATA 6Gb/s Port

• Ultra-Fast M.2 with PCIe Gen3 x2 interface

• 2 x HDMI, 2 x DP, eDP ports for multiple display

• 1 x COM Port (RS-232 & RI/5V/12V)

• 4 x USB 3.2 Type A Gen 2x1

• 2 x USB 3.2 Type C Gen 2x1

컨텐츠 정보

본문

Specification

Form Factor

3.5" SBC
146W x 101.7D(mm)

CPU

Intel® Core™ i3-1115G4E Processor
10nm SuperFin, 2 cores, 4 threads, up to 3.90 GHz
TDP 28W
6 MB Smart Cache

Socket

1 x FCBGA1449

Memory

2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual Channel DDR4 3200 MHz memory modules

Ethernet

2 x GbE LAN Ports (Intel® I219V and Intel® I211AT)

Video

Integrated Graphics Processor - Intel® UHD Graphics:
2 x HDMI 2.0 ports, supporting a maximum resolution of 4096x2160 @60Hz
2 x DP 1.4 ports, supporting a maximum resolution of 7680x4320 @30Hz
1 x DP 1.4 through USB type C (8k), supporting a maximum resolution of 7680x4320 @30Hz
1 x eDP port, supporting a maximum resolution of 4096x2304 @60Hz

(4 independent display outputs)

Audio

Realtek® Audio Codec

Storage

1 x SATA 6Gb/s Port (SATA RAID 0/1)

Expansion Slots

1 x 2280 M.2 M-Key (PCIe x2, SATA 6Gb/s)
1 x 2230 M.2 E-Key
1 x 3052 M.2 B-Key with SIM Slot (Support 5G)
1 x PCIe x4 (Board to Wire connector)

Internal I/O

1 x 4-pin box power connector (DC in +12V~24VDC)
1 x SATA Power header
1 x CPU fan header
1 x Front panel header
1 x Front panel audio header
1 x 2W Speaker out header
4 x USB 2.0 headers
1 x COM header (RS-232 & RI/5V/12V)
1 x eDP power header

Rear l/O

1 x USB type C (USB 3.2 Gen 2x1 + DP output-share with DP) & PD Out -100W
1 x USB type C (USB 3.2 Gen 2x1, PD input-100W)
4 x USB 3.2 Gen 2x1
2 x HDMI
2 x DP
2 x RJ45 LAN Ports

TPM

1 x TPM header

OS Compatibility

Windows 10/11 (x64)

Operating Properties

Operating temperature: 0°C to +60°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to +85°C
Non-operating humidity: 0%-95% (non-condensing)

Packing Content

Carton size: 465 x 351 x 217 (mm)
Packing Capacity: 10pcs

Single Box size: 221 x 178 x 65 (mm)
Single Box weight: Approx. 0.4kg

Including:
SATA power Cable x 1 (P/N: 25CRI-200B02-K1R)

Order Information

9MTGU3ASMR-SI (Box Packing)

Optional Kit

Fanless Heatsink P/N: 25ST1-1Z3101-AFR
Fansink P/N: 25ST4-113101-A7R
Heat spreader P/N: 25ST5-111500-Y0R
TPM 2.0 module P/N: 9CTM010NR-00
TPM Cable P/N: 25CRZ-100600-S9R

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